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内存模块 / NAND02GR3B2DZA6E
- 价格 起订量
- ¥ 0 1+
- ¥ 0 10+
- ¥ 0 100+
- ¥ 0 500+
- ¥ 0 1000+
- 型号: NAND02GR3B2DZA6E
- 厂商: TIH Microelectronics(方寸微)
- 类别: 内存模块
- 封装: -
- 描述: IC,EEPROM,NAND FLASH,256MX8,CMOS,BGA,63PIN,PLASTIC
- 库存地点: 内地
- 库存: 13
- 货期: 1 - 3 个工作日
个
总额¥ 0.00000
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包装流程
1.产品检查
2.塑料封装
3.防静电保护
4.包装入箱
5.贴条形码
6.出库运输
产品属性 产品问答
- 属性参考值
- 表面安装:YES
- 终端数量:63
- Type of connector:pin strips
- Connector:socket
- Kind of connector:female
- Spatial orientation:straight
- Contacts pitch:2.54mm
- Electrical mounting:THT
- Connector pinout layout:2x27
- Row pitch:2.54mm
- Rohs Code:有
- Part Life Cycle Code:Transferred
- Ihs Manufacturer:STMICROELECTRONICS
- Package Description:FBGA, BGA63,10X12,32
- Access Time-Max:20 ns
- Number of Words:268435456 words
- Number of Words Code:256000000
- Operating Temperature-Max:85 °C
- Operating Temperature-Min:-40 °C
- Package Body Material:PLASTIC/EPOXY
- Package Code:FBGA
- Package Equivalence Code:BGA63,10X12,32
- Package Shape:RECTANGULAR
- Package Style:GRID ARRAY, FINE PITCH
- Supply Voltage-Nom (Vsup):1.8 V
- ECCN 代码:EAR99
- HTS代码:8542.32.00.51
- 端子位置:BOTTOM
- 终端形式:BALL
- 端子间距:0.8 mm
- Reach合规守则:unknown
- JESD-30代码:R-PBGA-B63
- 资历状况:不合格
- 温度等级:INDUSTRIAL
- 电源电流-最大值:0.02 mA
- 组织结构:256MX8
- 内存宽度:8
- 待机电流-最大值:0.00005 A
- 记忆密度:2147483648 bit
- 并行/串行:PARALLEL
- 内存IC类型:FLASH
- 数据轮询:NO
- 拨动位:NO
- 命令用户界面:YES
- 扇区/尺寸数:2K
- 行业规模:128K
- 页面尺寸:2K words
- 准备就绪/忙碌:YES
- 个人资料:bronze
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