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片上系统(SoC) / M2S150TS-FCVG484I
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- 型号: M2S150TS-FCVG484I
- 厂商: Microchip Technology
- 类别: 片上系统(SoC)
- 封装: 484-BFBGA
- 描述: SoC FPGA M2S150TS-FCVG484I
- 库存地点: 内地
- 库存: 962
- 货期: 1 - 3 个工作日
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包装流程
1.产品检查
2.塑料封装
3.防静电保护
4.包装入箱
5.贴条形码
6.出库运输
产品属性 产品问答
- 属性参考值
- 包装/外壳:484-BFBGA
- 表面安装:YES
- 供应商器件包装:484-FBGA (19x19)
- 终端数量:484
- Shipping Restrictions:This product may require additional documentation to export from the United States.
- RoHS:Details
- Core:ARM Cortex M3
- Maximum Clock Frequency:166 MHz
- L1 Cache Instruction Memory:-
- L1 Cache Data Memory:-
- Data RAM Size:64 kB
- Number of Logic Elements:146124 LE
- Moisture Sensitive:有
- Number of Logic Array Blocks - LABs:12177 LAB
- Factory Pack QuantityFactory Pack Quantity:84
- Number of I/Os:273
- Package:Tray
- Base Product Number:M2S150
- 厂商:微芯片技术
- Product Status:活跃
- Package Description:VFBGA-484
- Package Style:GRID ARRAY, FINE PITCH
- Moisture Sensitivity Levels:4
- Package Body Material:PLASTIC/EPOXY
- Supply Voltage-Nom:1.2 V
- Reflow Temperature-Max (s):40
- Supply Voltage-Min:1.14 V
- Rohs Code:有
- Manufacturer Part Number:M2S150TS-FCVG484I
- Package Code:FBGA
- Package Shape:SQUARE
- Part Life Cycle Code:活跃
- Ihs Manufacturer:MICROSEMI CORP
- Supply Voltage-Max:1.26 V
- Risk Rank:5.82
- 包装:Tray
- 系列:SmartFusion2
- 操作温度:-40°C ~ 100°C (TJ)
- JESD-609代码:e1
- 无铅代码:有
- 端子表面处理:Tin/Silver/Copper (Sn/Ag/Cu)
- 附加功能:LG-MIN, WD-MIN
- HTS代码:8542.39.00.01
- 端子位置:BOTTOM
- 终端形式:BALL
- 峰值回流焊温度(摄氏度):250
- 端子间距:0.8 mm
- Reach合规守则:compliant
- JESD-30代码:S-PBGA-B484
- 速度:166MHz
- 内存大小:64KB
- 核心处理器:ARM® Cortex®-M3
- 周边设备:DDR, PCIe, SERDES
- 程序内存大小:512 kB
- 连接方式:CANbus, Ethernet, I²C, SPI, UART/USART, USB
- 建筑学:MCU, FPGA
- 座位高度-最大:3.15 mm
- 可编程逻辑类型:现场可编程门阵列
- 主要属性:FPGA - 150K Logic Modules
- 核数量:1 Core
- 闪光大小:512KB
- 宽度:19 mm
- 长度:19 mm
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