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FPGA(可编程逻辑门阵列) / AGL600V5-FGG256I
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- ¥ 0 10+
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- 型号: AGL600V5-FGG256I
- 厂商: Microchip Technology
- 类别: FPGA(可编程逻辑门阵列)
- 封装: FBGA-256
- 描述: FPGA - Field Programmable Gate Array AGL600V5-FGG256I
- 库存地点: 内地
- 库存: 2763
- 货期: 1 - 3 个工作日
个
总额¥ 0.00000
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包装流程
1.产品检查
2.塑料封装
3.防静电保护
4.包装入箱
5.贴条形码
6.出库运输
产品属性 产品问答
- 属性参考值
- 包装/外壳:FBGA-256
- 安装类型:表面贴装
- 表面安装:YES
- 供应商器件包装:256-FPBGA (17x17)
- 终端数量:256
- RoHS:Details
- Number of Logic Elements:7000 LE
- Number of I/Os:177 I/O
- Supply Voltage-Min:1.425 V
- Minimum Operating Temperature:- 40 C
- Maximum Operating Temperature:+ 100 C
- Mounting Styles:SMD/SMT
- Maximum Operating Frequency:892.86 MHz
- Moisture Sensitive:有
- Factory Pack QuantityFactory Pack Quantity:90
- Tradename:IGLOOe
- Unit Weight:0.014110 oz
- Minimum Operating Supply Voltage:1.425 V
- Maximum Operating Supply Voltage:1.575 V
- Family Name:IGLOO
- Operating Temperature (Max.):85C
- Operating Temperature Classification:Industrial
- Package Type:FBGA
- Device System Gates:600000
- Operating Temp Range:-40C to 85C
- # I/Os (Max):177
- Number of Usable Gates:600000
- Process Technology:130NM
- Operating Supply Voltage (Max):1.575(V)
- Operating Supply Voltage (Typ):1.5(V)
- Rad Hardened:无
- Operating Supply Voltage (Min):1.425(V)
- Operating Temperature (Min.):-40C
- Programmable:有
- # Registers:13824
- Mounting:表面贴装
- Package:Tray
- Base Product Number:AGL600
- 厂商:微芯片技术
- Product Status:活跃
- Supply Voltage-Max:1.575 V
- Package Description:BGA,
- Package Style:网格排列
- Moisture Sensitivity Levels:3
- Package Body Material:PLASTIC/EPOXY
- Operating Temperature-Min:-40 °C
- Supply Voltage-Nom:1.5 V
- Reflow Temperature-Max (s):40
- Operating Temperature-Max:100 °C
- Rohs Code:有
- Manufacturer Part Number:AGL600V5-FGG256I
- Clock Frequency-Max:108 MHz
- Package Code:BGA
- Package Shape:SQUARE
- Part Life Cycle Code:活跃
- Ihs Manufacturer:MICROSEMI CORP
- Risk Rank:5.25
- 系列:AGL600V5
- 包装:Tray
- 操作温度:-40°C ~ 85°C (TA)
- JESD-609代码:e1
- 端子表面处理:Tin/Silver/Copper (Sn/Ag/Cu)
- HTS代码:8542.39.00.01
- 技术:CMOS
- 电压 - 供电 :1.425V ~ 1.575V
- 端子位置:BOTTOM
- 终端形式:BALL
- 峰值回流焊温度(摄氏度):260
- 端子间距:1 mm
- Reach合规守则:compliant
- 引脚数量:256
- JESD-30代码:S-PBGA-B256
- 资历状况:不合格
- 工作电源电压:1.5 V
- 温度等级:INDUSTRIAL
- 数据率:-
- 组织结构:13824 CLBS, 600000 GATES
- 座位高度-最大:1.8 mm
- 可编程逻辑类型:现场可编程门阵列
- 逻辑元件/单元数:13824
- 总 RAM 位数:110592
- 阀门数量:600000
- 速度等级:STD
- 收发器数量:-
- 逻辑块数量:13824
- 等效门数:600000
- 高度:1.2 mm
- 长度:17 mm
- 宽度:17 mm
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